By Pepin Press
STRUCTURAL package deal layout is a sequence of books, packed with tremendous, a hundred% structurally exact, scalable packaging templates. All designs are prepared for fast use and illustrated with 2-D and 3-D structural drawings and pictures. The CD comprises the templates in quite a few codecs together with EPS and PDF. additionally integrated is a demos model of Illustrator?-Plug-Ins that offer specialist package deal layout chances. This quantity ? complex PACKAGING ? comprises two hundred extra complicated designs.
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Alloys include SnPb (eutectic), SAC, AuSn, InPb, etc. CVI also provides the assembly for our fine pitch (135 microns) and small solder bumps (75 microns) as well. Attaching solder bumps to Al pads can also be performed. com SAT Spirig Advanced Techn. Inc. 5 Micron Placement Accuracy etc. ➢ Substrate and device level le ltip tion u M lica p ap system traceability ➢ Supports new SEMI E142 standard ➢ Optimize UPH by skipping bad devices The Software Solution for Inkless Assembly and Traceability ➢ Enhance yield and chip design ➢ Provide instant device tracking reports.
Com Flip Chip Pole Position 10,000 UPH (dry cycle), 10µm@3s. Keep Pace with Technology from Datacon. com 34 CV Inc. C. com FRANCE, BELGIUM, SPAIN, Luis Matutano NETHERLANDS, 33-1-47-91-70-11; S. com GERMANY, AUSTRIA, Johann Bylek N. org 6, 34 Newport Corp. com 34 Photomachining, Inc. com 34 Spirig Advanced Technologies Inc. com 29 Umicore AG & Co. x. , Ltd. jp KOREA Wan Sik Yang, Chom Dan Inc. This ad index is published as a service. Advanced Packaging does not assume any liability for errors or omissions.
Since its inception MEPTEC has provided a forum for semiconductor professionals to learn and exchange ideas that relate to packaging, assembly, test, and handling through our newsletters, monthly luncheons and quarterly technical symposiums. If you design, process, fabricate, equip, supply, assemble, test, buy, or even think about ICs and semiconductors, it's time for you to join MEPTEC. org for more information about MEPTEC and our upcoming events. Join Us! MEPTEC 801 W. El Camino Real, No. be/ 3-D Architectures for Semiconductor Integration & Packaging 13-15 Tempe, Ariz.